Mech-El provides a full line of manual wire bonders for ultrasonic, thermosonic, and thermocompression bonding. Mech-El will continue to produce the 700, 800, 900 and 1200 series of bonders. Mech-el bonders will come with the MEI Manufacturers warranty. Mech-El is the only factory authorized service center. We provide prompt service and support.

Kulicke & Soffa iBond5000 Manual Wire Bonder for wedge and ball bonding of: - Al wires (20-76 μm) - Au wires (12.7-76 μm) - ribbons (up to 25 x 250 μm) 

K&S 4524 Digital Ball-Wedge Bonder Application Gold wire (25µm - 50µm diameter) ball-wedge bonding K&S 4523A Digital Wedge-Wedge Bonder Application Aluminum 

Innovative Industry-Leading Ball Bonding Solutions. Kulicke & Soffa's ball bonders are the leading generation of semiconductor assembly equipment for today's most challenging applications. With our long-standing tradition of innovation and technology leadership, the K&S ball bonders set new standards for performance, productivity, reliability

This Mech-El MEI Marpet 1204B Manual Gold Ball Wire Bonder with Ball Bump Option looks to be in good cosmetic condition, showing some signs of wear. It comes with a B&L SZ4 Microscope, a Uthe 10G Ultrasonic Gene United States Click to Request Price Trusted Seller West-Bond 7600C Deep Access 90° Feed Wedge Wire Bonder (refurbished) USED

The HB05 is a bench top size wire bonder, ideal for laboratories and pilot production lines. One bond head for bonding in ball/wedge or wedge/wedge bonding 

HB06/12 is a manual/ semiautomatic thermo sonic wire or ribbon wedge bonder. This bonder was designed to make 0.5 to 3.0 mil gold or aluminum wire or up to 1.0 x 10. 0 mil gold or aluminum ribbon electrical interconnections on a wide range of microelectronic packages. HB08/14 is a manual/ semiautomatic thermosonic wire ball bonder. This bonder

4526 Manual Wedge Bonder with Analog Controls The system is extremely simple to set-up and for ease of use incorporates analog controls. More 4522 Manual Ball Bonder with Analog Controls Advanced bench-top manual gold ball wire bonder with operator initiated controls and analog adjustments. More 4523AD Wedge Bonder with digital controls

The iBond5000-Wedge is an advanced wedge bonder- manual wire bonder- used for process development, production, research, or added manufacturing support.

K&S is the leader in wire and ribbon bonding for power semiconductors, automotive power modules, and industrial power hybrids. K&S wedge bonders ultrasonically bond round aluminum wires from 25 to 500 microns in diameter (1-20 mils) and use the PowerRibbon® process to ultrasonically bond aluminum ribbons from 500 x 100 to 2000 x 300 microns in cross-section

This chapter describes the K&S 4500 Series Manual Wire Bonders controls and indicators. 1.1 The Multi Mouse The Multi Mouse is located on the base either to the right or the left of the workholder table. The Multi Mouse has two functions: Control of the bonding cycle. Fine positioning of the bonding pad under the wedge/capillary.

Simple to operate and flexible like a classical manual bonder: just move the bond positions into place with the precise mechanical 

The MPP iBond5000 Wire Bonder series is based on the proven 4500 Series, the market leader for nearly a decade, and used mainly for Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers, Chip-on-Boards, Leads, Sensors, High Power Devices and much more.

In , Micro Point Pro Ltd (MPP) acquired from Kulicke and Soffa the business unit that designs and manufactures Manual Wire Bonders for Universities, R&D centers, and small production applications. Since then MPP is a world OEM leader in the Manual Wire Bonders industry with our state-of-the-art products and excellent global support.

Series 53: Manual Wire Bonders. • Complete, manual table top wire bonder. • If you need 1 to 1,000 bonds/day. • Wire bonder for small production volumes, high quality requirements. • Dual wire clamp system for reproducible loop and tails. • Gold-ball, thin wire wedge-wedge, thin wire deep access, heavy wire, heavy ribbon.

HB05. Manual Wire Bonder. ​. Ideal for laboratories and pilot production lines. Wedge, Ball, Bump and Ribbon bonding. 17µ to 75µ Wire & 25µ x 250µ Ribbon.